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Home > Products > Semiconductor Processing Equipment > Wafer-making Wafer-Making Products WAFER POLISHING PLATE, TURN TABLE AND CONDITIONING RING Material: 99.5% Alumina Size Availability: 12" to 35" in diameter Features: Surface Flatness: < 1 - 2 microns High Rigidity Excellent Wear Resistance Excellent Flatness Retention Compared to Metal SiC POLISHING PLATE FOR SINGLE WAFER PROCESSING Material: Silicon Carbide Size Availability: 12" in diameter Profile Availability: Concave, Flat and Convex Features: Surface Flatness: < 1 micron High Thermal Conductivity Low Thermal Expansion High Rigidity Excellent Wear Resistance The Best Flatness Retention Compared to Metal

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